Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef
Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't
Electronics Forum | Thu Jun 29 14:29:25 EDT 2000 | Glenn Robertson
Leon - Remember for a CBGA you will need to use high-temp solder balls. IBM can supply the recommended solder paste (eutectic) volume. Glenn Robertson
Electronics Forum | Wed May 31 13:14:42 EDT 2000 | Dason C
I learn from Senju Metal, they have a formula with certain percent of Ag and Cu can elimate the tombstone. The hint is the eutectic only one reflow and the new material have two reflow. Please let me know your result. Rgds. Dason
Electronics Forum | Wed Jan 26 13:02:13 EST 2000 | Wolfgang Busko
We don�t distinguish between BGA, finepitch or other parts; they all get the same aperture reduction of 15% which is determined by the finepitch process. We use only PBGAs with eutectic balls. Wolfgang
Electronics Forum | Wed Aug 23 15:10:24 EDT 2000 | Dr. Ning-Cheng Lee
Fillet lifting is a phenomenon mostly observed at wave soldering. It is caused by mismatch in thermal expansion coefficient (TCE) between solder and parts, and aggravated by the pasty range of solder alloys. Upon cooling, the mismatch in TCE will cau
Electronics Forum | Wed May 15 15:55:52 EDT 2002 | swagner
The Dek Infinity will cost you anywhere from $170-$210k dependant on option, I.E. gold camera, form flex support tooling, proflow printhead, paste inspection and aperature inspection all drive the cost of this machine. The only MPM I have quoted lat
Electronics Forum | Thu Jul 20 12:21:05 EDT 2000 | Dave F
Bob: Some people suggest different lead-free solder formulations for wave, reflow, and hand soldering. * What are your thoughts on this? * What are the factors that contribute to using different lead-free solder formulations for wave, reflow, and
Electronics Forum | Tue Jun 06 14:31:42 EDT 2000 | Jeff Sanchez
I have 25#'s of bismuth in my shop. I wanted to add some to my 63/37 till it was eutectic. This would allow me to lower the waves temp. Can I do this and still meet standards? Also would it make the solder joints to brittle and would discoloration be
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
