Electronics Forum: 2001 20of 2002 (Page 1 of 3)

APEX will continue in 2001 and beyond

Electronics Forum | Tue Jan 25 15:16:35 EST 2000 | Kim Sterling

SMTNETTERS - I apologize in advance if anyone feels this message is too commercial, but we have been receiving inquiries as to APEX's future after 2000, and just wanted to let the industry know that the event will continue. We have the following c

Reliability of U-shape appetures

Electronics Forum | Wed Jul 03 20:21:26 EDT 2002 | alex_kirichenko

Thanks for responding..... The question I was trying to ask is if U appetures are mechanicaly strong, if the tab in the middle won't stik up and damage squeegee blades? I never had stencil with such appeturs. We are just about to start some trials

How to reworking BGA

Electronics Forum | Thu Feb 28 07:57:52 EST 2002 | caldon

Marcos- BGA's and soldering manually is difficult. Typically soldering BGAs requires reflow just as a reflow oven does, so I recommend a rework station. Go to http://www.empf.org/html/empfset.htm and download Jan 2002, Dec 2001, Sep 2001, Aug 2001,

SMT PLACEMENT EQUIPMENT

Electronics Forum | Mon Oct 04 14:56:43 EDT 2004 | jasont

Would you consider pre-owned, 2002 vintage Samsung CP20CV? 2001 vintage CP33LV? Please reply to jason@tekmart.com Thanks, Jason

TRI For Lead Planning

Electronics Forum | Tue Apr 24 15:11:30 EDT 2001 | davef

For US folk ... "The U.S. EPA announced on April 17, 2001 that it will proceed with its Toxics Release Inventory (TRI) rule to significantly expand the information available to the public about lead emissions in their communities. The final TRI lead

SMT machine shift to China

Electronics Forum | Thu Jan 11 17:51:08 EST 2007 | Ryan

During the electronics manufacturing industry downturn in 2000,2001,and 2002, a very high amount of manufacturing capacity was shut down in North America and moved to Asia, mainly China. I'm interested in knowing how many SMT placement machines (u

Lead Free Component on solder paste (lead)

Electronics Forum | Thu Jan 03 08:32:28 EST 2002 | davef

You're correct. There's a range of issues. Two perspectives are: * TI and other suppliers has been shipping lead-free solderability protected leads on components for years. We have discussed, here on SMTnet, a need to adjust the reflow profile to

Is Anyone?

Electronics Forum | Fri Jul 12 16:36:43 EDT 2002 | dlkearns1

I am having the same luck as you. Been out of work since early November 2001. Best luck I have had is Monster.com, and remember that a LOT of companies are going through Temp. Agencies. I've run in to situations, a handfull of times where the employ

via in Pad

Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef

Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled

Oxidisation during Reflow

Electronics Forum | Mon Nov 25 20:38:39 EST 2002 | davef

That's basically it. In a wonderful world, the oxides flow on top of the flux during heating through reflow. Obviously when compared to reflow soldering, you create much more dross with your wave by: * Pumping a large volume of very hot solder to h

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