Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Thu Dec 27 09:56:36 EST 2012 | swag
100 sec.). If I keep TAL closer to where I like it to be, peaks are all low; around 200C to 205C. If I can't find a happy medium between TAL and PEAK, what should I consider doing?
Electronics Forum | Wed Mar 21 13:16:11 EDT 2012 | grahamcooper22
What solder alloy are you using at the moment which is coming to the end of its limits ? Normally in general for safe operation of an alloy we don't like to recommend any operation temp that is higher then two thirds of the solders melt point, but th
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Tue Oct 22 13:28:03 EDT 2002 | slthomas
Brian, Since the change, I have seen numerous instances of extra zeros being added to numeric values, typically those of 3 (original) characters or more. Case in point, a contribution by our friend Mr. Fish that I have cut and pasted: "The steadfa
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ
Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati
Electronics Forum | Tue Sep 18 20:01:46 EDT 2012 | vergara1
Thanks for the advice. We have only done one PCB > with HMP solder and did not use preheating, but > I've been wondering if it would have been helpful > since we had some trouble getting the solder to > flow. If you have any more specific advice
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