Electronics Forum | Tue Mar 25 11:23:25 EST 2003 | MA/NY DDave
Hi Benny, Move on over to some other forum like EDN or EETimes and piles more to post your question. Your luck will be vastly improved. This forum is not the best for electronic design issues like you are asking. YiENG, MA/NY DDave
Electronics Forum | Mon Apr 14 20:18:45 EDT 2003 | adlsmt
We use DBA. dbasoftware.com They are supposed to come out with a new version in the next few weeks. Its cheap for something with integrated accounting and its decent but its still stuck in "windows sort of but works like dos". Hope the re-write is be
Electronics Forum | Wed Mar 26 09:00:28 EST 2003 | swagner
I work for a company that uses both print heads, from all of the testing i've seen and participated in both seem to work well when you have a compatible paste. Focus more on the features you want on the printer, applications support and focus primar
Electronics Forum | Fri Mar 28 21:31:03 EST 2003 | MA/NY DDave
Hi Have you noticed with 3D scan technology a flatter and more filled top with the Rheometric when printing the smallest of aperatures. The Applications guys from the 3D companies told me they did see flatter tops. Granted this has to come also with
Electronics Forum | Thu Apr 03 10:33:53 EST 2003 | pjc
There was a preview (not released for sale) of the next-generation MPM Rheo Pump at the Cookson Electronics booth at APEX. Its pretty much a complete re-design. Major improvement in performance, maintenance and material conservation. Contact your loc
Electronics Forum | Wed Mar 26 19:11:52 EST 2003 | russ
Tell us more about your printer. squegge blade type ,speed, snap-off distance etc... You shouldn't have to change apertures for any component based upon its rotation. the parts that are coming out good could they withstand a higher volume print? You
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Fri Mar 28 21:37:11 EST 2003 | MA/NY DDave
Hi Are all the other solder joints for the other components other than the MELF not having a problem. That is what you said, yet I wanted to check?? To say a less twisted way is this only with the MELFs and is it with all the MELFs?? If you have
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
