Electronics Forum | Wed Apr 02 12:50:01 EST 2003 | rdr
Does anyone know of any standards that deal with the physical location of BGAs on a PCBA? I am looking for something that states to not put BGAs in the center Axis of assemblies for bow and twist reasons. We have always informed customers to locate
Electronics Forum | Fri Apr 04 17:43:52 EST 2003 | Kris
Hi, Did you use this paste before with out any problem or is it occuring for the first time ? If you wash only once a double sided board the side that passes through two reflow will have hardened flux which will may not be washed in your normal wa
Electronics Forum | Mon Apr 07 07:08:04 EDT 2003 | cyber_wolf
Does anyone have an example of an electronics X-ray quality procedure? We are implementing a new X-ray machine and it is my responsibility to compose the quality procedure. I know that each state has it own set of regulations, I am just curious to se
Electronics Forum | Mon Apr 07 13:02:30 EDT 2003 | kmorris
Sorry, I forgot to include the stencil thickness. It is 5 mil. Thanks for the input, everbody. I just checked with our stencil supplier & I thought that Electro-polish was standard with lazer, but I now find out it is not. Our stencil did not get
Electronics Forum | Mon Apr 07 17:08:09 EDT 2003 | jonfox
I remember an issue that we had with some SMD AEC's in the not too distant past. They had a thermal barrier that our reflow oven surpassed, not allowing us to run them through reflow. We ended up having to hand solder them in place post reflow. We
Electronics Forum | Sun Apr 13 17:02:24 EDT 2003 | MA/NY DDave
Hi In addition to DaveyF, I probably have this, yet let me give you a few places fast and you will probably find what you want from his, mine or the linkages. If not write again either way. http://www.edtn.com/ http://www.techonline.com/ http://ww
Electronics Forum | Tue Apr 08 16:03:29 EDT 2003 | jonfox
MTBF is hard to nail down raw data based on whether or not it is classified as IPC CII or CIII alone. Given that most failures are environmentally based, you might be able to get this data for CII and CIII in similar environmental testing situations
Electronics Forum | Wed Apr 09 12:18:37 EDT 2003 | MA/NY DDave
Hi This is an excellent question or research project. I would call the IPC and find out if anyone has already done this work. My guess is that Class III should be slightly better, yet considering the application difference where Class III is used
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
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