Electronics Forum | Tue Jul 19 08:12:23 EDT 2005 | davef
We agree with Rob. It looks like either kiss is blowing the paste around. It could be: * Nozzle id too large. * Kiss is occuring after the head has moved from the component. 0408%20MS%2001.jpg - Paste is not missing on the bottom-center pads. It is
Electronics Forum | Thu May 29 16:04:08 EDT 2003 | Rick B.
When is the U.S. required to fully implement the use of leadfree solder? European Directive 2002/95/EC is talking about year 2006 restricting the use of certain hazardous materials in electrical and electronic equipment.ie Lead,mercury,cadmium and he
Electronics Forum | Wed May 29 18:41:09 EDT 2013 | navworx
Hello, We have a used 2003 (refurbed by MPM in 2006) UP2000 HIE printer that runs NT 4.0. On the computer case is a Microsoft WinXP hologram sticker - does this mean that the printer can be updated to Win XP?
Electronics Forum | Fri Jun 06 07:34:43 EDT 2003 | johnw
Rick, my understanding is that the US do not have plan's fr lead free legislation. However the European legislation states that any product entering the european market after June 2006 must meet the lead free std's of the directive. So basically if
Electronics Forum | Tue Aug 22 20:32:40 EDT 2006 | davef
Fixed position (mounted) [In-line] laser bar code scanners: * microscan 800.762.1149 info@microscan.com [Ken SMTnet] * symbol technologies symbol.com [Russ SMTnet] * Keyence and RVSI inline scanners [B Norman SMTnet] * Datalogic TC1100 bartec-systems
Electronics Forum | Fri May 24 09:19:02 EDT 2019 | davef
http://www.nordsonselect.com. Accel: Cookson created Speedline after purchasing: MPM®, Electrovert®, Accel®, and Camalot®. In 2003, KPS Special Situations Fund II purchased Speedline from Cookson. In, 2007, Illinois Tool Works ITW acquired Speedlin
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Wed Feb 10 08:37:31 EST 2016 | davef
bga hosed by physics ... to find some older threads on the topic BGA Bowing on the corners. - SMTnet [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&Thread_ID=6405 ] www.smtnet.com › Electronics Forum • Aug 22, 2003 - 5 posts - 1 au
Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel
Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir
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