Electronics Forum | Fri Jun 06 10:47:27 EDT 2003 | Marc Peo
Kevin, Agree with John's thoughts on profiling and the max temp of 240 degrees in particular. To add to it a bit we have seen the following parameters put in place at many assembly houses to protect against overcooking the components: --Time above
Electronics Forum | Tue Oct 28 09:24:10 EST 2003 | davef
Running a soldered BGA through a wave solder pot is very risky: * 230-240*C temperature of the pot could damage the device. * Solder in the pot will certainly cause bridging between BGA solder balls. * Solder in the pot could melt BGA solder balls.
Electronics Forum | Wed Jan 29 18:27:25 EST 2003 | russ
That is one big melf!!! I do not even find this package size in any of my data bases. the largest i have ever dealt with is only .230 in. long. This one is .415 in. long? I would need to know the termination sizes also and then we can figure a pad
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Wed Aug 13 15:29:27 EDT 2003 | caldon
DUDE!!! The RS 64-2187 model: Select 230 watts (up to 11000F) for soldering metals such as copper, tin or brass. -Choose 150 watts (up to 9500F) for electrical, hobby, general soldering - One-finger, dual-heat trigger switch squeeze to first positi
Electronics Forum | Mon Aug 25 00:31:53 EDT 2003 | Dennis O'Donnelll
It could be moisture in the BGA. You should always bake the BGA before installation of course. But most likely you are usingf too much heat or too fast of a ramp speed. Make sure your top heater temp is below 230C. Set top heater to 220C, then adj
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Sat Mar 08 02:23:09 EST 2003 | Frank
My two Process Engineers are at odds with each other. One says that the Tact Time is only the actual Pick-n-Place time to build a board, and the other says it needs to include the load/unload time as well as the Fiducial reading time. Example: So
Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef
With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at
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