Electronics Forum | Thu Jan 27 20:54:30 EST 2005 | davef
Flexlink bought Flextek in 2001. Look here: http://www.flexlink.com/
Electronics Forum | Mon Apr 18 13:38:13 EDT 2005 | davef
IC tubes plastic * ITW Electronic Component Packaging Systems 2001 E Randol Mill Rd., Suite 117, Arlington, TX 76011-3453 817.277.5004fax3453 * Antistatic Industries, 130 Gamewell St PO Box 460 Hackensack, NJ 07602-0460 201.489.4400 fax 7654 * Perfec
Electronics Forum | Tue Jan 11 09:58:18 EST 2005 | jdumont
Well we actually bought a used 3AV system. Been running with no problems at all for a while now. We also already had a 3Z system that has not fared so well. We have replaced both the Y motors, 3 of the 4 Z motors, belts, pulleys, PCB's, spindles...et
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
Electronics Forum | Sat Dec 03 03:56:47 EST 2005 | hamidrezamaddah
Primary methods used to test circuit boards > are: * Automated test equipment [ATE] * Manual > bench-top functional test equipment > > Printed > circuit board ATE market segments are: * > In-circuit ATE * Functional ATE * Boundary > Scan ATE
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Tue May 03 21:46:13 EDT 2005 | KEN
I have 5 of these machines. What software version are you running. 24 inch frames will interfere with the USC. The solvent bar will ride on the stencil frame. This will not allow for a pre-load on the foil. 1. Adaptors suck! 2. Adaptors suck! 3
Electronics Forum | Wed Nov 02 21:50:23 EST 2005 | KEN
I beta tested these 6 months before general availability. These devices worked well in some situations and mrginally in others. Migrating to Gel may depend on what your current issues are with your current tooling solutions. Generally speaking it w
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