Electronics Forum | Mon May 28 22:43:20 EDT 2007 | fazan83
You can refer to this link. http://www.merix.com/files/Lead%20Free%20Material%20Tech%20Bulletin%20Rev%20C.pdf Hope this will help.
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
Electronics Forum | Mon Jun 18 10:11:52 EDT 2007 | dyoungquist
Almost every board/panel we build is double sided and we use an MPM SPM screen printer with no problems. The screen printer is not the cause. We have seen heavier parts fall off the first side when going through the reflow for the second side. We
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Mon Aug 13 16:07:08 EDT 2007 | dyoungquist
We run double sided surface mount boards through our Heller oven without any parts falling off the bottom side unless they are too big/heavy. The trick we use is to set the bottom side temperature in the final 3 heat zones 10C-20C lower than the top
Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Tue Apr 03 07:37:43 EDT 2007 | davef
Look here: http://www.circuitree.com/CDA/Articles/Column/BNP_GUID_9-5-2006_A_10000000000000075772
Electronics Forum | Wed Apr 25 03:31:53 EDT 2007 | GS
http://eur-lex.europa.eu/smartapi/cgi/sga_doc?smartapi!celexplus!prod!DocNumber&lg=en&type_doc=Decision&an_doc=2006ν_doc=691 Lead (Pb) in finishes of fine pitch components,see ANNEX item 23. GS
Electronics Forum | Wed Apr 25 16:37:48 EDT 2007 | ck_the_flip
Actually, I showed this to a customer recently http://farm.tucows.com/images/2006/01/uncle_rico_time_machine_2.jpg , and they were very impressed. I told them we could use this apparatus to build through-hole circuit cards from 1982.
