Electronics Forum | Wed May 14 15:15:03 EDT 2008 | boardhouse
Hi Scott, I have worked for a State side PCB Manufacture and now a Taiwan Manufacture. At both shops the up charge was based on how many up the pallet array was plus layer count and complexity of product, charges ranged from free to 15%. Standa
Electronics Forum | Mon May 19 10:35:58 EDT 2008 | samir
I agree with RealChunks. The application of any of these "wave solder process control tools" is dependant on how the shop is run. At some shops, PM is inconsistent and slacked off on. At other shops, there is no technical expertise at the operator
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Wed May 21 08:16:57 EDT 2008 | tonyamenson
Good morning gentlemen, I could use some advise as to the min / max windows for the wave process. We have had little problems with our leaded wave but when applying the same process to lead-free wave we are having problems. Obvisouly the temps are
Electronics Forum | Wed May 21 13:59:19 EDT 2008 | pjc
Here's what I've seen for no-clean flux applications: Leaded: Dwell Time is? 2 - 3 seconds Top side board temp max? If some small SMT parts reflow are we too hot? 110 to 120C top side board temp just before hitting the wave(s) Pot temp. 245C Lea
Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc
Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI
Electronics Forum | Fri May 23 04:25:14 EDT 2008 | muarty
One thing that has to be considered when using rheometric pumps is that the board support should match as that of the pump head being used. You can print 6" boards, but you should really still use board supports upto 16". As mentioned previously if t
Electronics Forum | Wed Jun 04 00:28:27 EDT 2008 | chrispy1963
There are a couple of things that you can do. First thing to do is take a flashlight and shine it in the card edge connector of slot 2 and see if a passive component or any other part worked its way into that slot. This will cause multiple leads in
