Electronics Forum | Thu Jul 26 18:15:52 EDT 2001 | Andy
Sorry - ayates@cyberoptics.com
Electronics Forum | Thu Jul 26 18:14:19 EDT 2001 | Andy
Doug, This could be our KS100 or KS50. We have a bank of cameras mounted above a conveyor. We're based in Minneapolis. I don't want to flood the board with advertising so if you need any info, please email me. Andy
Electronics Forum | Tue Jul 17 19:52:02 EDT 2001 | dougs
Does anyone remember the name of the company that had a small inspection system located on the tact line behind the CP732E from Fuji and the reflow oven? It was a real simple system located on top of a standard conveyor. Pick your brains and let me k
Electronics Forum | Tue Jul 17 22:32:30 EDT 2001 | CAL
One Inspection Unit was from Original Solutions. It was mid way through the line near the Fuji machine. If this is the system contact Mike Feld at OriginalSolutions.com The give away did no require sophistication and dont think there was two AOI unit
Electronics Forum | Fri Mar 19 11:40:28 EST 2004 | ccleland
The Multitroniks 2000 series machine was not a Europlacer machine. It was designed and build by Multitroniks as an entry level machine and has a very basic simple design. It has very easy to use software and a very heavy stable platform but quality
Electronics Forum | Thu Jan 20 20:22:16 EST 2000 | Sam Guilaume
We have run some experiments on double side BGA assembly. Our preliminary results show that complete overlap of top and bottom BGA's indicate fair results, even after reliabiltiy tests (vibrations, temperature cycles, HALT). I will be interested to h
Electronics Forum | Fri Dec 22 17:25:00 EST 2000 | Dave F
I'd bet money our operators could use the wrong paste at the wrong time with out the slightest hesitance. This seems to be a fairly novel approach to making things complicated. I will admit I've heard of people talking about doing this, but I must
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
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