Electronics Forum | Tue Feb 22 17:03:48 EST 2000 | Chris
Dek 249 and Dek 260 models use to have fiducial recognition where table would adjust to the stencil. However, I would still recomend you buy an inline model because the change over will be much faster. Probably 10 times faster.
Electronics Forum | Wed Dec 13 14:37:06 EST 2000 | Chris
I should explain that this bake out was performed after population. The solder paste slumped terribly after this bake out. However, after the back out and after reflow, no bridging.
Electronics Forum | Tue Feb 22 17:03:48 EST 2000 | Chris
Dek 249 and Dek 260 models use to have fiducial recognition where table would adjust to the stencil. However, I would still recomend you buy an inline model because the change over will be much faster. Probably 10 times faster.
Electronics Forum | Thu Nov 04 15:57:46 EST 1999 | Dave F
I'm with John. Back in the old MIL-2000 days, the pot temperature was 245-275C (475-525F). Now, 240-260C (460-480 F) is more accepted for eutechic (eutechicish) solder. My2� Dave F
Electronics Forum | Wed Dec 13 16:47:41 EST 2000 | Michael Parker
It is apparent that you have evaporated the flux before you reflowed. You got lucky when the paste slumped and you didn't get major problems elsewhere. A more reliable solution is to adjust the stencil apertures for the part that is experiencing bri
Electronics Forum | Wed Dec 13 18:41:33 EST 2000 | Steve A
Chris, I am not a chemist, but my best guess would be that you were able to remove some of the solvents from the paste flux without exhausting too much of the activators. The loss of solvents could have cut down on violent boiling (violent boiling
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Thu Jul 20 16:28:55 EDT 2000 | Bob Willis
Most robust wave soldering machines will cope with lead free alloys. The temperatures in air that we have run has been between 260-265C. In my opinion the dross generation has not been significantly effected. I was doing a workshop for a well known
Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Tue Apr 11 20:37:06 EDT 2000 | Dave F
Rich: Now that�s a great question!!! You�re corrrect. Primary-side temperature is the driver of the differences in the sensitivity to moisture between SMT and PTH devices that you�re finding. * Primary-side temperature for SMT ~= Secondary-side te
