Electronics Forum | Tue Jun 05 08:20:43 EDT 2018 | charliedci
We use MORESCO-HILUBE R-220, out of Greenville, SC. Heller recommended, their PN 593555. They sell 250mL, I believe straight from Moresco smallest is 4 liter.
Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef
Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1
Electronics Forum | Tue Apr 05 03:16:45 EDT 2011 | grahamcooper22
one of my customers with a BTU VIP 70 has the following settings, 100 / 175 / 210 / 250 / 265 with conveyor speed of 18 ins per minute. They get a peak temp of 240~245C and time above liquidus of 220 C is @ 55 secs. Built in thermocouples should give
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Wed Aug 24 08:03:17 EDT 2005 | james
I need some help here. I just to see what suggestions anyone else has. Our Man. Eng. has 3 profiles on our 9 zone Heller Reflow oven. These are the profiles: 1. 120 140 150 150 180 200 215 250 220 29in per minute 2. 120 130 145 150 150 185 20
Electronics Forum | Wed Feb 12 14:38:18 EST 2020 | SMTA-Alex
There are several areas you can check. Your profile is very fast. You reach the peak at around 3 minute mark. That's not enough time for the fillet to form. Try to slow down your belt speed to around 90-95, to give it more time. Also, your temperatur
Electronics Forum | Tue Aug 05 12:05:15 EDT 2003 | mleber
Through hole question - what methods can be used to obtain upflow on multi layer pwbs with huge ground planes. We are using a water soluble flux with a max temp of 220 topside. I am pushing the limits of the flux and hitting 250 topside in an attempt
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Tue Jan 30 08:21:02 EST 2007 | GS
Please who can help me? I am looking for fiducial (cross shape) mark (target mark? Swiss mark?..)specifications used when COB wire bonding on PCB laminate. Pad pitch should be 250umm may be 220umm?). Mainly need to know which are the tolerances
Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto
Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat
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