Electronics Forum | Wed Sep 18 15:40:12 EDT 2013 | pankalaitz
Hello, we have problem with indicator. When we manually install a spring loaded tool into the Midas head, the force remain at 180. We can't use spring tools. Can you advise me how can we calibrate the force indicator and what else should I try to fix
Electronics Forum | Tue Jul 17 10:09:48 EDT 2012 | cyber_wolf
Phil is on the right track. Try this.... Go into the service program, and bring up the vacuum force indicators. Manually install a spring loaded tool into the Midas head. Once the tool is in the head, press on the tip of the nozzle with your finger.
Electronics Forum | Mon Jun 04 23:52:57 EDT 2012 | rway
Actually, if you experience lack of witness marks, you probably have a problem. Witness marks are OK and will not affect your assembly. I assume this is an SMT assembly we are talking about, in which case, this is what your test pads are for. You
Electronics Forum | Mon Jun 18 21:31:16 EDT 2001 | davef
I know of no nor can I imagine a specification for "spring pressures or the requirement for pin marks on the test pads". The issue is whether the boards pass the test or not. If your supplier neglected to process the boards as agreed upon, then the
Electronics Forum | Tue Jan 08 17:33:26 EST 2002 | davef
You didn�t identify the type of tape you use, but Kapton or similar tape is not an effective method for attaching thermocouples. Search the fine SMTnet Archives for alternatives and comparison of methods. Two methods for mechanically attaching ther
Electronics Forum | Thu Feb 07 13:46:07 EST 2008 | slthomas
I would probably try to get my boss to spring for a digital anemometer (air velocity meter) and figure out what my velocity needed to be to get the specified airflow. Then just check it daily before production starts and when it starts to slow down,
Electronics Forum | Mon Jan 25 15:51:02 EST 2016 | aemery
SP1 is a bi-metal spring loaded switch or the "air fault" switch on the main air manifold that detects the presence of an appreciate amount of air being supplied to the machine. Air pressure overcomes the adjustable spring and closes the contacts.
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
| 1 |
