Electronics Forum | Wed Jan 22 09:59:28 EST 2003 | Juan C. Ruiz
I would like to know how to decide what to use: a batch oven or a conventional reflow oven to cure an underfill material that require 20 min@150 C. the size of the board is 50 X 100 mm. Cycle time previous to cure is 2 minutes. The lenght of the refl
Electronics Forum | Wed Jan 07 17:34:52 EST 2015 | duchoang
Customer puts our board to thermal test. Test cycle is -55c to 85c, repeat cycle in 15-20min. After 600 cycles, lot of TSOP joints are cracked, leads lifted. There are reasons such as thin PCB, mechanical impacts, warped PCB... My question is, how lo
Electronics Forum | Mon Oct 09 10:00:15 EDT 2006 | C.K. the Flip
I had a customer like this too. Originally, the customer print called for manual soldering of the RF shield (which took us about 20 min. per shield to hand solder), but I changed it to Solder Reflow (I cut apertures on the stencil), with brass weigh
Electronics Forum | Thu May 05 02:40:30 EDT 2016 | padawanlinuxero
Hello guys! I have a question for you guys, we have been working with a cleaning agent call Safewash (SWAS) from electrolube, we use this safewash to clean the flux residue from the boards after wave soldering, since or customer doesn't like to have
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