Electronics Forum | Wed Oct 11 19:06:35 EDT 2017 | dorado
how can I configure an MPC with another IP address already that the one that had damage the problem is in a juki 2070
Electronics Forum | Mon Mar 19 09:24:46 EDT 2018 | grek
Hello, try to find Operation options on your machines And try to find something like: Treat the same components as alternatives feeders. I know only 2070/2080 but it could be similar. Not sure if this is what you need but you can try
Electronics Forum | Fri Nov 19 13:37:10 EST 1999 | JAX
I have recently started programming Siemens equipment (Monday) and am a little confused on some issues. When inspecting BGA packages does the machine locate a corner ball and use it as an anchor to locate the rest? If not how does it know that it has
Electronics Forum | Wed Aug 23 16:18:47 EDT 2000 | Dr. Ning-Cheng Lee
I presume you are referring to vibration test with fixed frequency at room temperature. One procedure describing the detailed profile is in MIL-STD-883E, Method 2005.2 (12/31/96). The approximate profile can be described as 60Hz, 20-70g, and 96 hrs t
Electronics Forum | Fri Nov 19 16:36:15 EST 1999 | JAX
Thank you for the info but when I say anchor I am asking if it uses only one ball (pin one). I believe you are saying it uses a predefined number from every corner to map out the part according to the description given inside the GF. If this is true,
Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi
Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help
Electronics Forum | Tue May 17 01:32:34 EDT 2022 | sarason
Another method would be to do a screen dump on a Juki 2070,2080 machine, but that gets you back to the chicken and egg scenario. My program PCBSynergy doesn't reverse out the board file from a machine file while Ealead does . Also the programs EPU, F
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
Electronics Forum | Fri Nov 19 14:50:46 EST 1999 | nick mata
If you are seeing reflection on the underside of the part, I would first begin with the recommended light levels for the BGA. You should be able to obtain the levels from the Siemens help desk. There is a 2 to 3 page document with levels for a variet
