Electronics Forum | Wed Jan 03 18:44:13 EST 2001 | Todd Koeppel
If we procure parts with a Sn/Ag termination, can we still use standard Sn/Pb solder pastes and the current reflow and wave processes?
Electronics Forum | Tue Nov 16 18:02:29 EST 1999 | John Holland
What are the main advantages of moving from a 140 degree C FR4 laminate to a higher Tg laminate 180 degree C ?. Would the higher Tg laminate be less susceptable to bow and twist ?. John Holland
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
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