Electronics Forum: 20c 250 (Page 1 of 1)

Leaching

Electronics Forum | Tue Apr 29 09:43:30 EDT 2003 | davef

With a nickel barrier and 'tin' plating, reconsider your reflow recipe to reduce the leaching of the termination into the solder during reflow. Points are: * In designing a reflow temperature recipe, it is important that the temperature be raised at

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