Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Thu Oct 21 09:56:11 EDT 1999 | Brian
Rich An excellent question and one which is often totally ignored. If you wish a "no-clean" flux to be as safe as it possibly can be, the PCB and the components must all be contamination free (ionic and non-ionic). Only then can you be sure that the
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