Electronics Forum: 20gold release agents (Page 1 of 2)

Cleaning assembled circuit boards?

Electronics Forum | Thu May 20 08:51:29 EDT 2010 | jry74

A lot of our dewetting is happening on plastic body components, such as ICs. When they are manufactured, the molding process requires a mold release to make the part release after molding. Usually, the release agent is silicon based, but you can't

Evaluating SMD Adhesives

Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker

Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr

Help with dewetting

Electronics Forum | Tue May 25 11:37:50 EDT 2010 | davef

Where on the assembly is the dewetting occurring? Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Comp

Re: Fuji PD Development

Electronics Forum | Wed Jul 05 22:29:06 EDT 2000 | George

Matt, I suppose the automated system you refer to is the VPD-101 camera system that captures component image and with a few clicks on the mouse you are able to define all the element data and dimensions of that part. Check with your local Fuji agent,

Conformal coating

Electronics Forum | Fri Dec 10 12:24:46 EST 2010 | davef

Causes of dewetting in conformal coating. Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Component res

Re: Clean before conformal coating?

Electronics Forum | Fri Jan 05 09:23:10 EST 2001 | Brian Toleno

While there may not be any specific requirement to cleaning prior to coating, cleaning an assembly prior to coating will only serve to increase the reliability and integrity of the coating. Some residues from low-solids fluxes can interact with conf

Re: Universal 4760 HSP

Electronics Forum | Mon Jun 07 08:46:53 EDT 1999 | Jason Gregory

|Yes, I am aware of this machine being a Sanyo. I was told, however, that due to confidential agreements, Sanyo will not release any information pertaining to the specs of the machine. I was hoping to obtain the specs of the cutting blade to make my

Re: Universal 4760 HSP

Electronics Forum | Fri Jun 11 16:21:33 EDT 1999 | Dan Perkins

|Jason, The stroke of the cutter blade cam rod is fairly tight, is machine making loud clunking noise when it stops? If so stoke may need to be adjusted. Send me an email if you would like to talk. dan |Yes, I am aware of this machine being a Sa

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Wed Jun 03 01:06:13 EDT 1998 | Mike Moninger

| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al

Indium NC-SMQ92J paste problems

Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz

Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin

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