Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Jan 13 16:16:31 EST 2006 | Reminder
this one last posted........ was in 2004...
Electronics Forum | Tue Jan 17 10:18:32 EST 2006 | bobpan
I wonder what Dr. Lou ended up buying?????
Electronics Forum | Fri Mar 03 15:27:24 EST 2006 | TM
What should I expect? Any and all info would be great.
Electronics Forum | Fri Mar 03 15:51:17 EST 2006 | TM
Sorry I meant CP60 Series
Electronics Forum | Fri Mar 03 19:38:10 EST 2006 | Helpful Hand
http://www.dynatechsmt.com/cp63.cfm
