Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Sun Aug 21 15:54:15 EDT 2005 | Ken
not to be anoying....but a topaz can be configured with a 54mm camera an when using the 20 micron head 1 spline. It will place accuratly to +/-0.02mm Imagine 1 machine that works from 0402 to 54mm square! Now that's flexible.
Electronics Forum | Tue Nov 30 16:35:58 EST 1999 | Dave F
The lead Wade is speaking about is not (technically) in solution. It is in suspension (or someting like that). The lead is solder balls, flakes, and the like that is offal from his soldering process. He needs to filter this material from the waste
Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran
What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man
Electronics Forum | Sun Jun 27 06:27:15 EDT 1999 | Vic Lau
| I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | Any suggestions? | Dear Matt, I have a customer, who is com
Electronics Forum | Mon Jun 28 14:36:34 EDT 1999 | John Thorup
| | I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | | Any suggestions? | | | Dear Matt, | | I have a customer
Electronics Forum | Thu Oct 25 16:48:29 EDT 2001 | Cemal Basaran
We can inspect and measure strain field in anything larger than 320nm with Laser techniques we have. We can do this measurements during fatigue testing. Of course thick intermetallic region as a solid region is a problem due to the fact that you ha
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Fri Jun 05 19:33:55 EDT 1998 | Steve Gregory
Hidee Ho Brian! Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. We're a contract assembler as well, just starting up.
