Electronics Forum | Tue Oct 13 16:11:44 EDT 2009 | mikesewell
Not sure how many inspections need to be done at 15 - 20sec total per board, but you may need to install multiple SPIs/AOIs to hit your takt time. Mike
Electronics Forum | Fri Oct 31 13:06:42 EST 2003 | Kris
Hi, What would also be important is the time above 217. 20 secs above 225 may be the same as 45 secs above 218 That 7 degres might just buy you enough to sweep the non lead free components through Has anyone tried 220 or 218 peak temp but at lo
Electronics Forum | Fri Oct 29 10:39:48 EDT 1999 | JohnJ
Bill, Thanks for the input. I took a brief look at the Brady machine on their website. I think their latest is the PAM 6000. It didn't appear it could keep up. My most difficult application is to put 42 labels on a 21-up board in under 1 min 20 sec.
Electronics Forum | Sat Aug 17 07:48:43 EDT 2002 | bentzen
Hi Brandon. You should always try to optimize / "balance" your line in a way so the machine with the shortest time per placement is your bottleneck. The other machines in the line should then have a 10 - 20 sec sorter cycle time, to be able to cope
Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
Electronics Forum | Tue Feb 03 10:25:56 EST 2009 | milroy
Hi What is the surface finish you have? Following are true if you have HASL-LeadFree surface. I have had the same problem 3years ago and we did some micro-sectioning for further analysis, still the boards are functioning properly. But you have to
Electronics Forum | Wed Feb 16 12:47:58 EST 2011 | dennisfo
I've been here approx. 3 months. It was indicated that Xylene has alwas been used but it was never indicated that bubbles were not present in the past (ignored or touchup). I have a sample of Humiseal 73 thinner ordered for testing. We've been thinne
Electronics Forum | Mon Oct 03 15:13:00 EDT 2011 | tombstonesmt
It sounds to me that it's a heat transfer issue. The solder is only bonding to the lead on not the barrel correct? Does your selective solder equipment have any type of heating source? Can you "dwell" on that particular joint? On some of our products
Electronics Forum | Wed Jul 06 16:40:05 EDT 2005 | Inds
the problem with using SAC305 is we have a very small window within which the connnector has to be removed.. otherwise Cu will dissolute. Now this process window is something between 20sec to 30 sec..depending at what temperature you are reworking th
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
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