Electronics Forum | Thu Nov 18 02:53:31 EST 2004 | galp
Chack this contact "micro Assembly technology" tel: +972-4-9592225
Electronics Forum | Thu Nov 18 07:02:14 EST 2004 | davef
Cntinuing with the previous thread: http://www.mat-ltd.com/
Electronics Forum | Mon Nov 15 15:31:54 EST 2004 | GP
We are looking for machine that can do the following: bonding of 0.5x0.5x0.8mm mm cramic part. - detect target surface position 1.5x0.8mm - dispance a drop of 0.8mm of epoxy adhesive on trget surface with position accuracy of +/-0.04mm. - pick the 0.
Electronics Forum | Wed Apr 11 09:51:26 EDT 2018 | emeto
Diego, the first question you have to answer is "Is the paste volume too much in real?" How does your paste look? To check that, I would say you measure bare board with your SPI and see if your SMT pads show you zero, or may be not? If your value fo
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Thu Sep 06 22:01:21 EDT 2007 | syedsmt
Hi! I am Syed from Hitachi located in Malaysia.It seems that the discussion about OSP is very much related to the dillema that I am facing in my company.I am the Senior Executive for the SMT Department at Hitachi.Currently we are facing some issues w
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton
| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
