Electronics Forum | Mon May 10 16:36:16 EDT 2004 | davef
Look here: http://www.aimsolder.com/techarticles/tech%20sheet%20BGA%20voiding-%20reducing%20through%20process%20optimization.pdf We have no relationship, nor receive benefit from the company linked above.
Electronics Forum | Thu Feb 19 14:21:35 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Correct from 2% to 20% voiding unacceptable.
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
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