Electronics Forum | Fri Apr 30 07:45:15 EDT 2004 | Frederic
Hi all What adhesive you recommend to catch thermocouple to the board? (resistant to high temp and easy remove from PCB) Thank Frederic
Electronics Forum | Wed Feb 15 08:29:50 EST 2006 | pjc
In order of effectiveness / accurate reading: 1. Hi-Temp Soldering 2. ECD's Temprobe or new Flexiprobe http://www.ecd.com 3. Glue, such as SMT adhesive 4. Aluminum tape Capton tape should not be used as it expands at reflow temps.
Electronics Forum | Wed Feb 23 09:33:03 EST 2005 | rlackey
Hi, Does anyone have any experience of using electrically conductive adhesives, including info on the following? 1) Autodispensing/screen printing 2) Curing temps/profiles 3) Quality/conductivity of joint 4) Product recommendations Our customer w
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Wed Dec 09 13:25:16 EST 1998 | Martin J. Ibarra
Hi, I know for sure that by controlling temp. and humidity conditions in SMT assy lines room, one gets advantage in screen printing, adhesive dispensing, and pick&place machines mainteinance. Does any one have any advice on why else is a clean room
Electronics Forum | Wed May 03 21:07:36 EDT 2000 | Eric Chua
Hi Steve, I had face problem before. What I did, add addition process which is screen print that apply adhesive. During thru-hole assemble, the components hold strong by the solder. Try this.
Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman
In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi
Electronics Forum | Wed Dec 09 14:36:26 EST 1998 | Earl Moon
| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c
Electronics Forum | Wed Dec 09 22:40:48 EST 1998 | phillip fhunter
| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (