Electronics Forum | Wed Sep 29 09:29:47 EDT 2010 | swag
Take a few parts from the reel and look close at the parts to make sure the bottom surface of the leads is below the bottom surface of the body.
Electronics Forum | Wed Sep 29 08:26:03 EDT 2010 | babe7362000
We are Currently running a Board and it seems that the SOT-223's on the bottom side have flux and water trapped under the part. Nothing has changed in our process and this is the only board that it is happening on. We are using Kester R562 water wa
Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000
Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Sun Sep 29 01:28:42 EDT 2013 | tonnyneoden
This is Tonny from China ,I am a salesman at NEODEN TECH CO.,LTD . We are a factory specializing in the manufacture and export of desktop automatic PICK AND PLACE MACHINE (SMT MACHINE) for more than four years. We are the leaders in this technology i
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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