Electronics Forum | Thu Jun 05 14:20:55 EDT 2014 | isd_jwendell
230C for max 30 sec.". Isn't 225C close enough to 230C, so that you are effectively exceeding mfg spec by 60 sec.?
Electronics Forum | Thu Feb 10 16:45:36 EST 2005 | pjc
It all depends on what type of board you need to solder. If your boards are small in size and low thermal mass and your conveyor speed requirments are normal, then I'd say the OmniFlo 7 will do the job. It has a max zone temp setting of 280C. The cur
Electronics Forum | Thu Jun 06 14:59:47 EDT 2019 | cristian_amlima
Awhile back I faced a few problems because of that. To solve the problem, my only concern was about the peak temperature to assure that the alloy got melted. Peak temperature between 230°C and 235°C can assure that and usually is inside the sodler pa
Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar
flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt
Electronics Forum | Wed Feb 04 08:49:52 EST 2009 | milroy
Hi First of all you have to respect the dwell time and the time after the reflow at peak tmeperature.(225�C for Pb and 235�C for Pbf) You can find the reflow profile from manufacturer for majority of parts designed for reflow sodlering. In general t
Electronics Forum | Fri Feb 23 09:55:02 EST 2024 | carl_p
Got you. 225C for peak does seem low to me. Henkle is the main one i've used with a peak of 245c & Alpha around the same although I try to keep that at no higher than 235C as we use it for LED arrays. If the peak is that low, is the liquidus te
Electronics Forum | Mon Oct 18 22:15:11 EDT 2004 | KEN
I have two industry leading customers that have specific requirements for components to survive 30 seconds above 230C. In one case I have a custom ASIC that is heat sinked on the die (to the PCB). The sink pulls heat out of the lead frame very effi
Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Mon Apr 09 14:05:25 EDT 2001 | slthomas
CAL's word of caution is right on. We tend to stay in the 220C-225C max. temp. on our profiles, and that's because the last heads up from engineering came on a part with a spec. of 230C max. temp. We just found out that one of our old SOIC's is spe
