Electronics Forum | Mon Aug 10 19:41:22 EDT 1998 | Brian
Does anyone know a supplier of SOT23 (6 lead) surf boards, sockets, or proto boards?
Electronics Forum | Mon Aug 10 19:41:10 EDT 1998 | Brian
Does anyone know a supplier of SOT23 (6 lead) surf boards, sockets, or proto boards?
Electronics Forum | Fri Jun 26 11:15:21 EDT 1998 | David Spilker
I have been asked to evaluate the use of and SOT-23-6. I guess that this part has been around for awhile, but I have never used one. It looks straight forward enough, but I was wondering if anyone out there in forum land has found any special issue
Electronics Forum | Fri Apr 13 10:57:50 EDT 2007 | bigguy
hi we have an Essemtec FLX 2010 L that has a large board capacity of 600x700mm(23.6x27.5")
Electronics Forum | Mon Apr 09 10:16:14 EDT 2007 | davef
Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. Fuji NP XL series allows 27 by 23 inch boards using a conveyor. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * HSP 4796A a
Electronics Forum | Tue Jan 20 04:43:33 EST 2015 | gragal
I need to replace a device which is in a 6-pin package which looks like SOT 23-6 / SC-74 style. The markings are D102/ 214B (D102 above 214B). I have checked numerous references to no avail. I think that the device is a comparator or op-amp with V
Electronics Forum | Sat Jun 28 07:19:32 EDT 2014 | sramos
Based on your knowledge and experience, could you tell me about speed differences when placing a mix of SMD at mass production? We could consider packages like the small R & C chips, then SOD323, SOT-23, SOT-23-5, SOT23-6, SON6, QFN8, SOIC-8, SOIC-16
Electronics Forum | Fri Jun 26 16:23:14 EDT 1998 | Steve Gregory
Hi Dave! Yeah, they've been around a while, and they're pretty straight foward like you said. About the only things that I can think of that I've run across that causes problems with these guys is when they're used on the bottomside of the board
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
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