Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Fri Nov 30 06:16:25 EST 2007 | aj
Hi all, What do most of you aim for when profiling BGAs ? Currently I aim for time above 60 or 70 secs but I read a report that 40 secs would be more suitable. Also peak temp - I aim for 240-245 but again this report stated 230-235. any input app
Electronics Forum | Thu Feb 18 15:25:13 EST 2010 | spitkis2
An air temperature tolerance of +/- 3 deg C along a 200mm width would not play a significant role on the board's temperature due to its thermal mass. However if the air temperature varies by 10C along the conveyers width, I can see how a 5 degree va
Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
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