Electronics Forum | Thu Jun 05 14:20:55 EDT 2014 | isd_jwendell
230C for max 30 sec.". Isn't 225C close enough to 230C, so that you are effectively exceeding mfg spec by 60 sec.?
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Mon Feb 20 17:11:13 EST 2006 | pjc
From ambient, about 25C, that's to peak overall to about 230C. Dave's got the link to the SMQ 230 sheet.
Electronics Forum | Wed Oct 04 16:30:12 EDT 2006 | russ
I hope you are not trying to melt the Ceramic BGA columns. these are not meant to melt. I would run a lead process at peak temp of 225 -230C with lead paste. The board warpage may be of design issue or Manufacture issue. Russ
Electronics Forum | Wed Oct 04 16:18:06 EDT 2006 | cw
My Peak ~ 228-230C (customer wants to see this temperature). solder ball size - 20mil diameter Please advise ASAP. Thanks a lot!!!
Electronics Forum | Thu Jun 19 14:33:57 EDT 2008 | realchunks
My board reaches 240 C for 45 seconds. Most of my lead free parts require 230 C for a minimum of 30 seconds.
Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura
Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.
Electronics Forum | Thu Jun 05 13:52:33 EDT 2014 | swag
230 C for 30 sec. max. We are not infringing on either limit. What can we do? Is this common? Is there accept/reject standards that I don't know about for something like this? Our customer HATES F.O.D. so that is likely why they are having issue
Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork
Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster
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