Electronics Forum: 25microns (Page 1 of 3)

I need 15 - 25 microns (T5) Solder Paste

Electronics Forum | Thu Jan 06 15:51:58 EST 2011 | flipit

Indium has it.

I need 15 - 25 microns (T5) Solder Paste

Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs

I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Using an air hose to clean stencils

Electronics Forum | Fri Nov 05 03:53:29 EDT 2010 | Mark

The smallest particle sixe for type 3 paste in 25 microns. This is far to big to remain airborne.Therefore I would suggest to continue to use air to clean stencils as it does clean the apertures effectively.What solvent is used to clean the stencils?

I need 15 - 25 microns (T5) Solder Paste

Electronics Forum | Wed Jan 05 21:22:13 EST 2011 | bajin

Where you are? http://www.esdcoats.net pls check if we are near from you.

Percentage of Blowholes and Pinholes can eliminate.

Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003

Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's

PCB Au thickness

Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef

J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin

MyData Placement Accuracy

Electronics Forum | Thu May 18 03:47:20 EDT 2006 | Scott

We have 2 Mydata machines. Accuracy is closer to 25microns at 3 sigma and you'll be lucky to get a quarter of the 20K placement rate. Their flexibility is their selling point and are prefectly suited for high mix - low/med volume. I wish your high vo

Re: Flip chip placer

Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley

| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere

Connector leads plating

Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay

Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr

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