Electronics Forum | Fri Apr 23 11:31:35 EDT 1999 | J.J. Thomas
A customer told me that pad geometry was to be different depending on soldering process. I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should not e
Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko
Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul
Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F
| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should
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