Electronics Forum | Sat Jun 30 09:35:59 EDT 2001 | dmr
I have tried just about everything avalible for BGA inspection on the market. We use X-ray which is great, even through we have a 5-d machine, I use my 2-d unit most often. We also have the expensive scope that lets you look completely through under
Electronics Forum | Wed Jul 31 08:23:49 EDT 2002 | mcm4me
221C). 2D vision can very effectively detect % pad coverage, I use it on my DEK and this customer has an MPM which I also believe to be capable. Here is another fact, when the customer uses Brand X solder paste the defects due to what they call pad
Electronics Forum | Wed Jul 19 09:21:54 EDT 2006 | Chunks
That's like asking who's Mom is the best Mom. Your main goal in choosing a screen printer is based on several things: Size for your boards. Speed of your line. Board layout in ref to edge clearance / use of breakaways. Post inspection 2D/3D of paste
Electronics Forum | Mon Oct 09 14:30:44 EDT 2006 | Brian
I agree with Chunks. Programming was much simpler. The 2D inspection is much better on MPM. I didn't have to use offsets on the MPM or the DEK very often, but did more on teh DEK. I didn't like the front justified stencils on the DEK. I also did
Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef
You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod
Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Fri Jun 08 09:53:23 EDT 2007 | rgduval
What is the general consensus on automated solder paste inspection? In a previous life, when we implemented AOI equipment, we implemented it at the end of the SMT line; our reasoning was that our screen printers had adequate repeatability for our pr
Electronics Forum | Wed Dec 05 03:33:22 EST 2007 | longlee
We have done Paste-In-Hole process for 4 years.I think this prcess is suitable for 28-pins connector. Of course, you must assure the connecotr can endure high temperature firstly.Secondly, you need calculate the volume of solder paste, you can refere
Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC
When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re
Electronics Forum | Tue Dec 27 13:58:20 EST 2005 | samir
I think alot of those X-Ray machines out there "over-emphasize" BGA analysis. It'll measure every aspect of the BGA, like size of voids, percent voids, how many voids, cumulative sum of the voids, shape and geometry of voids, statistical distributio
