Electronics Forum | Tue Mar 23 10:57:14 EDT 2010 | oeidave
Have you checked out YESTech X-Ray systems? Their 2D X-ray systems to fit your requirements and they are usually at a very reasonable price point for what you get. Good Luck
Electronics Forum | Wed Feb 13 12:44:05 EST 2008 | ck_the_flip
Larry, from my days of working for a Telecom. company, Bellcore standards (now Telcordia) was our BGA Void guideline. There was some verbiage in the guideline that accounted for allowable VOID VOLUME ...keep in mind, VOID AREA and volume are 2 diffe
Electronics Forum | Tue Apr 07 13:17:10 EDT 2009 | tserra
I would recommend looking at SAKI/MacroScience. http://www.xraytechnology.eu/index.php?option=com_content&task=view&id=34&Itemid=42 I have seen the images created by MSX3000 from MacroScience which is now under SAKI and can tell you with certainty
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Wed Jan 12 20:20:54 EST 2000 | Bene
I had the opportunity to spend time with a demo and one on one with the inventor of the Ersa scope inhouse a few months ago. I see the scope complimenting X-ray inspection but not as a substitue. It allows you to view attributes of a solder joint t
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
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