Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim
Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~
Electronics Forum | Tue Oct 05 08:05:42 EDT 2004 | Grant
Hi, Has anyone had any experience with lead free Sn-8Zn-3Bi solder paste? Apparently in Japan it's becoming popular because it's got a melting point of below +200C. Can anyone confirm that, or does anyone have experience with it? Regards, Grant
Electronics Forum | Tue Feb 17 10:08:17 EST 2004 | russ
Do you have a bake oven that will reach 200C? You could bring a batch of boards up to temp and then start the pluckin'. A sfar as the solder goes if you apply flux to the leads they remove very clean as far as solder goes. To remove the flux we pl
Electronics Forum | Mon Aug 16 11:58:29 EDT 2004 | Dreamsniper
I've worked with a Vapor Phase Oven a semi-automatic and a manual oven for evaluation. They worked fine and produce better grain of solder joints. The fluid that you need depends on the solder temperature that you require. I've used a 200'C fluid for
Electronics Forum | Fri Oct 29 04:07:27 EDT 2004 | Nick.W (TWN)
Hi, > > Has anyone had any experience with lead > free Sn-8Zn-3Bi solder paste? Apparently in Japan > it's becoming popular because it's got a melting > point of below +200C. > > Can anyone confirm that, > or does anyone have experience with >
Electronics Forum | Tue Feb 13 15:56:16 EST 2007 | darby
Campos, This is a direct reply I recieved from Indium, (thanks to Rich Brooks), in late 2004 regarding SMQ230. I have followed these guidelines with good results using ENIG finish. Same also applies to Indium 5.1 apply to both alloys (SAC 387 and 305
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