Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
Electronics Forum | Thu Aug 08 10:32:30 EDT 2019 | SMTA-Joe
Ok, interesting. Unfortunately I can't speak on that. We always treat these as a 2nd ops and have never had a problem. We determined it was something that could add to thermal trouble. Also, the amount of solder added during paste deposition may not
Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker
To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component
Electronics Forum | Fri Oct 07 15:28:33 EDT 2011 | fishingfool
assybkr, I don't work with Yestech, just know many of them and have dealt with them in the past. I talked with a couple of the guys and asked them about this. If you call in and want to buy parts they explain that if you are not the orginal pur
Electronics Forum | Mon Jan 04 22:59:23 EST 1999 | Kris Ewen
I'd like to add something about the ECD product. During a past work term (I'm a a co-op student) in an SMA plant, I worked extensively with the Super MOLE Gold in developing the reflow profiles for high-mix, low-volume production. I was 'married' t
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