Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez
Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Tue Jun 03 08:33:06 EDT 2014 | patel_daxa29
Do I need to lower temperature of bottom zone (for common size parts) while reflow 2nd side of the board or I should be using same profile as I used for 1st side reflow? Will parts on bottom side will stay in place without changing temperature?
Electronics Forum | Tue Jun 03 10:38:20 EDT 2014 | patel_daxa29
Thank You Chris.
Electronics Forum | Tue Jun 03 10:30:36 EDT 2014 | cbeneat
We have the same ovens, our 2 sided boards have the same profile for both sides. Haven't seen a problem in 8 years.
Electronics Forum | Tue Jun 03 12:08:14 EDT 2014 | emeto
I don't think you decide that based on the oven. More important is what kind of parts you have on the board. If you have big heavy parts you should run them as second side.Of course you have the option to put glue under the suspicious part and run it
Electronics Forum | Tue Apr 07 21:56:32 EDT 2009 | davef
electrovert bravo 4050 to find things like: Cookson Electronics News, ISSUE #6 � SUMMER 2002, High Temperature Bravo� 4050 Reflow Oven Available: ELECTROVERT� has introduced a new high temperature reflow soldering system designed for producing lead
Electronics Forum | Wed Jun 24 13:52:31 EDT 2009 | jimpat
I have worked with both a batch and 5 zone conveyer oven. Both ovens worked very well. The batch was used for prototypes and low volume processing. Conveyer oven was more efficient when reflowing medium to large quantities. Basically there are ad
Electronics Forum | Sat Apr 04 03:24:41 EDT 2009 | monduran
Our company is in the market to replace the $50 toaster oven we use to reflow boards with something that can actually achieve even temperature and a proper reflow curve. We are a RnD type company and have no need for volumes. Though we have some heav
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
