Electronics Forum | Fri Oct 27 08:24:41 EDT 2023 | avaqsemi
When designing a PCB to accommodate an intrusive reflow narrow profile connector (electrode rectangular) with specific dimensions, you'll need to consider the pad size, hole size, and other factors to ensure proper solderability and mechanical stabil
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Fri Dec 20 10:13:38 EST 2002 | davef
The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. So, a 1210 chip size has a lower inductance than a 1206 chip. Check with your supplier for recomm
Electronics Forum | Wed Dec 09 10:45:56 EST 2015 | huske
I've put down a SOT223, close enough to your 3pin transistor, in the same situation you have. The large pin was to be soldered on a large exposed ground plane in the corner of a board, over 2"x2" exposed area. We left the paste file as is, so where
Electronics Forum | Mon Nov 13 13:26:43 EST 2017 | rcooley4
Hi all, I'm in the market for a BGA rework machine capable of handling a wide range of PCB's, anything from little 2"X2" board up to 15"X15" back-plane boards that are 0.100" thick. I would like to find a machine that can remove BGA's & QFN's, clean
Electronics Forum | Fri Apr 21 22:52:44 EDT 2006 | SD
I've been using an Omrom machine for over 5 years now. I have mixed feelings about it. It has paid for itself many times over, but it needs constant tweaking. Constant tweaking is something I believe all AOI machines need, but the way our system wo
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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