Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
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