Electronics Forum | Wed Jul 22 12:51:37 EDT 1998 | John
1. One line/shift 2.One NPI per shift 3. 75 to 125 hours depending on complexity, includes MRP prep, doc. prep and prove-in
Electronics Forum | Sun Jan 06 22:48:42 EST 2008 | mac88
Hi, Just put the ID Badge on a EDS-Safe carrier. From "All-Spec" catalog: #1196-3722 - Personnel Badge Holder Clear Dissipative 3.75"x2.25" 6mil with Clip
Electronics Forum | Mon May 08 16:01:11 EDT 2000 | John
I was running the conveyor at 3.75 when we started the discussion with Electrovert. Unfortunately, foam fluxing is a fact of life for us. Our products have open contact relays that can become contaminated by spray fluxing. Titration is our only me
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton
If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
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