Electronics Forum: 3 electronics (Page 11 of 874)

Heller 1706EXL increased thermal cascade on last 3 zones

Electronics Forum | Mon Sep 27 19:45:25 EDT 2021 | jdengler

Are the zone fans all working? I have had some odd temperatures when a fan starts to go out.

Heller 1706EXL increased thermal cascade on last 3 zones

Electronics Forum | Tue Sep 28 06:16:34 EDT 2021 | bukas

sometimes SSR can stay in ON state. load cooldown and check if SSRs ever go OFF.

Heller 1706EXL increased thermal cascade on last 3 zones

Electronics Forum | Tue Sep 28 08:52:13 EDT 2021 | majdi4

I agree with jdengler .. Check the zone fans if their working good ! It may be the root cause of this problem .

Heller 1706EXL increased thermal cascade on last 3 zones

Electronics Forum | Tue Sep 28 11:58:09 EDT 2021 | stephendo

Do you mean reflow profiles are showing 20F above set points or is the oven display is showing 20F above set points?

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl

hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef

It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S

Solder Wave Vitronics Soltec Delta 3 TRACKING problem

Electronics Forum | Mon Apr 09 09:39:40 EDT 2018 | justconmac

Having an issue with tracking for the Vitronics Soltec Delta 3. Wave will not give error on "expected PCB at exit" but will still show 1+ pcb's in the wave when the machine is empty. This is causing solder pump to idle unnecessarily. Outfeed sensor i

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl

thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)

What are the best profiles for 3 zone ersa reflow?

Electronics Forum | Fri Mar 27 14:12:10 EDT 2009 | rgduval

Check with your paste manufacturer for a recommended baseling. The paste manufacturers generally have a database by oven that gives optimal performance for their paste. It's only a baseline, and does need to be adjusted based on the thermal foot pr

NXTII M6 Generation 1 and NXT III M6 Generation 3

Electronics Forum | Wed Jul 18 21:58:38 EDT 2018 | ir11

Hi There... Sorry to post another query here but I have an existing line for pick & place machine using FUJI NXT II M6 Generation 1. We would like to add NXT modules but then the available modules that we have now is NXT III Generation 3. Is it pos


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