Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Thu Aug 22 20:34:19 EDT 2002 | chao liang
thank you , Mark thank you so much
Electronics Forum | Wed May 05 09:00:53 EDT 2010 | davef
IPC-A-610D Sections 3.1, 3.2, and 3.3 and Table 3.1 specifically mention compressed air as a source of ESD damage
Electronics Forum | Wed Aug 21 21:00:59 EDT 2002 | chao liang
we will use melf nozzle , we want to know how to setting the part data (or other item in f4g ), so the machine (cp642) can identify it from the nomal 1.3nozzle . thanks
Electronics Forum | Thu Aug 22 02:18:09 EDT 2002 | mjabure
Specify the nozzle size as 1.4 in both the nozzle allocation table and the PD, the nozzles will still pass center test as the size variation is still within tolerence.
Electronics Forum | Thu Aug 22 23:18:03 EDT 2002 | mjabure
you're welcome. if you have any other questions you can e-mail me, my address here is mjabure@smtnet.com. Used to be a machine instructor for fuji.
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