Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Wed Dec 05 03:33:22 EST 2007 | longlee
We have done Paste-In-Hole process for 4 years.I think this prcess is suitable for 28-pins connector. Of course, you must assure the connecotr can endure high temperature firstly.Secondly, you need calculate the volume of solder paste, you can refere
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Thu Oct 04 00:00:58 EDT 2018 | gaintstar
Flason SMT Reflow Ovens: http://www.flason-smt.com/product/China-Reflow-oven.html http://www.flason-smt.com/product/China-Samsung-EXCEN-PRO-High-Speed-SMT-Modular-Chip-Mounter-agent.html http://www.flason-smt.com/product/China-Samsung-SM321-High-Spe
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