Electronics Forum | Tue Aug 13 12:39:56 EDT 2024 | griinder
Are we interpreting J-STD-001 section "3.3 Fluxes" correctly? Is this stating ORH0 solder paste can not be used on class 2 and 3 products?
Electronics Forum | Tue Aug 13 23:22:50 EDT 2024 | simonattwood
3.4 says the solder paste shall meet requirements of 3.3 3.3 says the flux shall be L0 or L1 or if it is not you must have data demonstrating compatibility as per Appendix C. So if you wanted to use ORH0 solder paste, and be J-STD-001 compliant, yo
Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Wed Feb 27 17:01:41 EST 2013 | jayjjackson
I was wondering where i could get training on this particular machine. The company i work for is located in northern Arizona. So somewhere close would be great. Its a Desktop AOI Machine MV-3/3L.
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
Electronics Forum | Wed Nov 29 15:54:30 EST 2023 | xxxxx1
Hi Everyone, please someone help me. Disc 2 (2/4) of my ASYMTEK FM 3.3G software is damaged. can someone help me to replace a floppy disk? it would be great if i could download it or if someone could send me the files. Thanks!
Electronics Forum | Wed May 05 09:00:53 EDT 2010 | davef
IPC-A-610D Sections 3.1, 3.2, and 3.3 and Table 3.1 specifically mention compressed air as a source of ESD damage
Electronics Forum | Thu Jun 02 11:01:28 EDT 2005 | davef
Xilinx recommended reflow ||Sn-Pb Eutetic||Sn-Pb Eutetic ||Pb-Free||Pb-Free Profile Feature||Large Body||Small Body||Large Body||Small Body Average ramp-up rate (TL-TP), *C/seconds max||3||3||3||3 Preheat - Temperature Min (Tsmin), *C||100||100||150|
winsouce.jpg)