Electronics Forum: 3.3.5 (Page 1 of 1)

j-std-033 3.3.5.1 HIC Placement

Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano

3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to

j-std-033 3.3.5.1 HIC Placement

Electronics Forum | Wed Jan 22 07:05:11 EST 2020 | dontfeedphils

Just make sure they're in different parts of the bag before vacuum sealing. After the bag is sealed, neither will be going anywhere (unless your sealer isn't up to snuff and the bag leaks).

j-std-033 3.3.5.1 HIC Placement

Electronics Forum | Wed Jan 22 08:23:49 EST 2020 | dgiordano

Thank You! We don't vacuum seal - we just heat seal. The standard doesn't require vacuum sealing, correct?

j-std-033 3.3.5.1 HIC Placement

Electronics Forum | Wed Jan 22 08:25:27 EST 2020 | dontfeedphils

I don't believe it does, but don't quote me on that. Vacuum sealers can be had for pretty cheap.

j-std-033 3.3.5.1 HIC Placement

Electronics Forum | Thu Jan 23 07:41:32 EST 2020 | stephendo

Too much vacuum can be very bad. It can create isolated pockets where the desiccant can not do anything. It can poke holes in the bag at corners. It can even pull moisture into the bag if too strong.

moisture sensitive components/packaging

Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm

"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea

Cable for UIC 6348A

Electronics Forum | Wed Jan 26 08:36:06 EST 2005 | jdengler

Sasha, A standard RS-232 cable with the proper connectors would work. If you want you can make it. Normally the PC will have a DB-9 theses days so the wiring would be PC Machine DB-9 DB-25 2------2 3------3 5------7 Good

SMT component handling

Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3

Flux residues

Electronics Forum | Thu Nov 15 10:19:05 EST 2012 | davidmercader

Hi, We have problems with our wave soldering process. The problem is that during the same assembly, after wave soldering, some pcb’s look not clean and other pcb’s look good. We use lead free SAC305 solder and flammable flux. We think our proces

Wavesoldering SPC

Electronics Forum | Tue Jan 30 13:53:50 EST 2001 | cebukid

Wolfgang is correct - Dwell Time is influenced by conveyor speed and of course, pump speed. Contact Length (the length of contact between board and wave) is something that you might want to track. Contact Length greatly influences process defects l

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