Electronics Forum: 35 sec (Page 1 of 5)

Wave Solder Dwell Time

Electronics Forum | Sat Nov 04 20:17:25 EST 2000 | Greg G

Hi Guys, I'm sorry to ask you this, but I got mixed infos from the archive. I want to define a process in wave soldering regarding bd-wave interaction. Now "What's the required dwell Time of a lead in the solder bath?" Some says 3-5 secs is good, som

THE ANSWER FOR MR. EARL MOON

Electronics Forum | Fri Jul 23 01:32:21 EDT 1999 | KYUNG SAM PARK

HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY

Asahi Viromet Lead Free Paste

Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne

Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (

Palladium poor wetting

Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef

First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s

Re: THE ANSWER FOR MR. EARL MOON

Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon

| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED

HIP defect in BGA

Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan

Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr

simple doubt about reflow profile

Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby

As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from

5 zone ovens

Electronics Forum | Fri May 26 10:17:21 EDT 2006 | pjc

Here are settings for a Vitronics SMR500 oven for Indium Corp. 5.1 No-Clean Pb Free solderpaste, the product profiled was of medium thermal mass: RTS, Temp C 120, 170, 195, 248, 264, conveyor speed was 43cm/min (17"/min.) Peak temps were reached in

BGA process

Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33

5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc

Tombstone caused by flux residue

Electronics Forum | Thu Jul 14 04:28:45 EDT 2005 | lloyd

Folks, Thanks for all the info and suggestions but let me add a bit more to the pot. Our products work in a harsh environment and are classed as safety critical. Customer returns are our biggest concern, we don't get very many and feeling here seem

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