Electronics Forum: 3609 curing profile (Page 1 of 19)

reflow profile

Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony

I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde

adhesive on pads

Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas

* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo

BOTTOM SIDE CHIP COMP FALLEN OFF IN WAVE SOLDER

Electronics Forum | Mon Dec 21 11:28:47 EST 2009 | lynn_norman

We used Loctite 3609 and never had problems. If memory serves me isn't 3606 a screen print adhesive? First thing I would check is the cure profile of the adhesive. If it doesn't develop full adhesion, could be problems. Nuther question is are you

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef

I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman

I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of

Epoxied Parts Falling Off

Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi

Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th

Industry SMA's for evaluation

Electronics Forum | Wed Oct 20 15:47:14 EDT 1999 | Shane

I am developing a D.O.E for Surface Mount Adhesives and was wondering if anyone out there had any recommendations on a certain brand. I currently have samples of Loctite 3609, 3615, 3618, Heraeus PD955M and MA-420 by Lord Chemicals. I understand Ci

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher

We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?

SRT Summit 1000 Users?

Electronics Forum | Thu Sep 10 13:09:28 EDT 1998 | Rick Thompson

Hi, I'm having trouble getting good profiles for a couple of BGA's we're placing in small quantities and was hoping someone with SRT Summit 1000 experience might be willing to share some information regarding profiles, etc. Thanks. Rick Thompson

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