Electronics Forum | Wed May 16 14:09:22 EDT 2001 | davef
First thing I'd use is IPC-A-610C, �4.8.2 Connector Pins - Press-Fit Pins. Does it work in your case?
Electronics Forum | Mon May 21 10:06:54 EDT 2007 | patrickbruneel
Dave, Thanks a lot; you truly are a living database. I will need new spectacles missed the eutectic alloy in table 4.8 of the Klein Wassink book.
Electronics Forum | Tue Aug 03 14:32:04 EDT 2010 | keiths487
random nozzle and head combo's all around the turret...head 1,4,8,11,13,14 and always nozzle 1 or 2
Electronics Forum | Thu Apr 20 20:04:39 EDT 2023 | jamesatqkits
5 ppm from cylinders, thank you for taking the time to respond. Originally I ran no spec nitrogen, and got good results, when I started having issues I changed to 4.8 spec
Electronics Forum | Sun Apr 01 09:50:15 EDT 2001 | davef
I have no first hand knowledge, but the following may help: JAPAN MARKETING ASSOCIATION Head Office: 3 rd Floor, Wako Bldg., 4-8-5 Roppongi, Minato-ku, Tokyo 106, Japan Tel: +81-3-3403-5101 Fax: +81-3-3403-5106 http://www.jma-jp.org/JMAhome/Eng/Mai
Electronics Forum | Tue Jul 03 22:18:33 EDT 2001 | davef
Assuming that you are talking about voids in solder connections: * Consider voids on the surface of your solder connection a defect. * Consider voids that you can't see to be a process indicator. See A-610C, 12.4.8 for authoritative guidance.
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman
I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a
Electronics Forum | Mon Feb 14 17:36:37 EST 2005 | griinder
WE ARE USING MIRAE MX240. ON THIS MACHINE, THE FEEDER ADVANCE AND THE FEEDER PITCH IS CONTROLLED BY THE MACHINE/SOFTWARE AS OPPOSED TO THE FEEDER ITSELF. OUR SELECTIONS FOR 24MM FDDERS ARE 4,8,12, 16, AND 24MM.I WAS WONDERING IF THE 20MM PITCH WAS UN
Electronics Forum | Mon Oct 12 16:01:42 EDT 2009 | dyoungquist
Check out RPS Automation. We have had good results with their selective solder machine that we purchased 1 year ago and they have wave nozzles as well in the 4-8 inch range. Changing from a selective solder nozzle to the wave nozzle takes only a fe
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