Electronics Forum | Wed Jun 13 21:25:48 EDT 2001 | dougk
We've tried the MPM rheo., with excellent results. We saw a decrease in fine-pitch pad coverage rejects from ~20% to bacicially ~0%. Print speeds went from 1-2 in/sec (metal blade) to 4-5 in/sec (rheo.). Could probably go faster. Great throughput. Li
Electronics Forum | Fri Feb 19 11:13:02 EST 2016 | ttheis
I'm setting up a product for the first time on my GSM after I completed debugging some other issues. The previous owners had the PWC axis disabled and the axis motor disconnected, so I re-connected it and enabled it and now it homes and moves. When I
Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry
We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti
Electronics Forum | Fri Dec 17 16:07:07 EST 1999 | Alex B
Hi, C.K. Let's assume that your stencil's thickness is in a range 4-6 mil or by other words the height of the solder paste on a pads is the same (close enough to reality) Therefore, for pad's width more than 20 mils(as well as pitch between pads) th
Electronics Forum | Fri Sep 24 19:17:36 EDT 1999 | Tom Tellinghuisen
Al, There are no 'rules of thumb' that you can utilize for plastic devices. I have seen various Moisture Sensitivity Levels, (MSLs), for the same package type, i.e. PLCC28s as levels 1, 2,3,4,5, even 6 in some cases. Your best bet is to call
Electronics Forum | Thu Sep 16 05:37:18 EDT 1999 | Earl Moon
| Can you imagine that there is a smt process using the a few chip and ic are nearly about 4,5,6,8 years old. | Antigues?? | what should you do If you are an engineer of smt process in that company. | | | | thank in advance. | | I'm s
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Tue Apr 27 12:04:44 EDT 1999 | Bob
I hope I'm not too late with some help for you. I have purchased stainless steel wire cleaning baskets for a vapor degreaser from: Cooley Wire Products 5025 North River Road Schiller Park, IL 60176 847-678-8585 fax 847-678-8612 They do a very nice
Electronics Forum | Fri Feb 26 11:39:21 EST 1999 | Cunli
There are only 4-5 corrupted registrations. We have notified or tried to identify and then notify them. Others can log in by typing in their username and password. Even those who did not complete their registration can log in and be prompted to comp
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
